SUBSTRATE CLEANING APPARATUS AND METHOD AND BRUSH ASSEMBLY USED THEREIN
    1.
    发明申请
    SUBSTRATE CLEANING APPARATUS AND METHOD AND BRUSH ASSEMBLY USED THEREIN 有权
    基板清洁装置及其使用的方法和刷子组件

    公开(公告)号:US20140366913A1

    公开(公告)日:2014-12-18

    申请号:US14301669

    申请日:2014-06-11

    CPC classification number: H01L21/67046 A46B13/001 B08B1/04

    Abstract: Provided are a substrate cleaning apparatus and method and a brush assembly used therein. The substrate cleaning apparatus for contact-cleaning a substrate includes a cleaning brush rotatably disposed in a cylindrical shape and having an outer circumferential surface contacting the substrate to clean the substrate. Here, the cleaning brush includes a plurality of pressure chambers expanding by a fluid pressure and disposed along a longitudinal direction of a rotation axis rotating at a central portion of the cleaning brush, and the plurality of pressure chambers are individually expandable to allow a portion of the outer circumferential surface to protrude in a radial direction and thus contact-clean a portion of the substrate.

    Abstract translation: 提供了其中使用的基板清洁装置和方法以及刷组件。 用于接触清​​洁基板的基板清洁装置包括可旋转地设置成圆柱形状并具有与基板接触的外周表面以清洁基板的清洁刷。 这里,清洁刷包括多个压力室,其通过流体压力膨胀并且沿着在清洁刷的中心部分处旋转的旋转轴线的纵向方向设置,并且多个压力室单独地可膨胀以允许 所述外圆周表面沿径向突出,从而接触所述基底的一部分。

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