公开(公告)号：US12288741B2

公开(公告)日：2025-04-29

申请号：US18297150

申请日：2023-04-07

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/34

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

公开(公告)号：US08813015B2

公开(公告)日：2014-08-19

申请号：US13725215

申请日：2012-12-21

Applicant: Juniper Networks, Inc.

Inventor： Srinivas Vaduvatha ,  Srinivas Venkataraman ,  Anurag P. Gupta ,  Praveen Garapally ,  Norman Bristol ,  Dibyendu Sen

IPC: G06F17/50 ,  G06F12/00 ,  G06F13/40

CPC classification number: G06F12/00 ,  G06F13/409

Abstract: A system includes a memory and a controller. The controller may include a group of pads and an allocation register. The controller is configured to receive input signals corresponding to the group and allocate each one of the pads to output one of the input signals based on a configuration of pins of the memory. The controller is also configured to redirect the input signals, within the controller, based on the allocation of the pads and output the input signals from the controller into the pads.

Abstract translation: 系统包括存储器和控制器。 控制器可以包括一组焊盘和分配寄存器。 控制器被配置为接收对应于组的输入信号，并且基于存储器的引脚的配置来分配每个焊盘以输出输入信号之一。 控制器还被配置为基于焊盘的分配来重定向控制器内的输入信号，并将输入信号从控制器输出到焊盘中。

公开(公告)号：US20210057319A1

公开(公告)日：2021-02-25

申请号：US17089414

申请日：2020-11-04

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/00

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

公开(公告)号：US20230245964A1

公开(公告)日：2023-08-03

申请号：US18297150

申请日：2023-04-07

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H05K1/113 ,  H05K3/3436 ,  H01L24/11 ,  H01L24/73 ,  H01L24/03 ,  H01L24/09 ,  H01L2924/15311 ,  H05K2201/10734 ,  H01L24/17

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.

公开(公告)号：US11652035B2

公开(公告)日：2023-05-16

申请号：US17089414

申请日：2020-11-04

Applicant: Juniper Networks, Inc.

Inventor： Granthana Kattehalli Rangaswamy ,  Arvind Hanumantharayappa ,  Srinivas Venkataraman

IPC: H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L24/03 ,  H01L24/11 ,  H01L24/73 ,  H05K1/113 ,  H05K3/3436 ,  H01L24/09 ,  H01L24/17 ,  H01L2924/15311 ,  H05K2201/10734

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.