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公开(公告)号:US20010018950A1
公开(公告)日:2001-09-06
申请号:US09849888
申请日:2001-05-04
IPC分类号: B32B031/00
CPC分类号: B29C66/65 , B29C65/1406 , B29C65/1448 , B29C65/1454 , B29C65/1467 , B29C65/1487 , B29C65/1606 , B29C65/1629 , B29C65/1648 , B29C65/1654 , B29C65/1687 , B29C66/52272 , B29C66/545 , B29C66/612 , B29C66/80 , B29C66/83411 , B29C2035/0827 , B29L2031/04
摘要: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.
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公开(公告)号:US20010015255A1
公开(公告)日:2001-08-23
申请号:US09849855
申请日:2001-05-04
IPC分类号: B32B031/00
CPC分类号: B29C66/65 , B29C65/1406 , B29C65/1448 , B29C65/1454 , B29C65/1467 , B29C65/1487 , B29C65/1606 , B29C65/1629 , B29C65/1648 , B29C65/1654 , B29C65/1687 , B29C66/52272 , B29C66/545 , B29C66/612 , B29C66/80 , B29C66/83411 , B29C2035/0827 , B29L2031/04
摘要: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.
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公开(公告)号:US20010015254A1
公开(公告)日:2001-08-23
申请号:US09849889
申请日:2001-05-04
IPC分类号: B32B031/00
CPC分类号: B29C66/65 , B29C65/1406 , B29C65/1448 , B29C65/1454 , B29C65/1467 , B29C65/1487 , B29C65/1606 , B29C65/1629 , B29C65/1648 , B29C65/1654 , B29C65/1687 , B29C66/52272 , B29C66/545 , B29C66/612 , B29C66/80 , B29C66/83411 , B29C2035/0827 , B29L2031/04
摘要: A device for curing an obscured photosetting compound in a subassembly part has a base for supporting the assembly and a plate mounted to the base. The plate has a lens that concentrates UV light into a narrow slit in the assembly to quickly cure the compound. In an alternate version, the plate has a parabolic opening with a mirrored surface for gathering the UV light. A third version of the invention uses a rotatable fixture to position the assembly beneath a UV laser light source to cure the compound.
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