公开(公告)号：US20190327857A1

公开(公告)日：2019-10-24

申请号：US16458711

申请日：2019-07-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US12041710B2

公开(公告)日：2024-07-16

申请号：US17451995

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhen Sun ,  Zhen Lu ,  Yuping Hong

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20336

Abstract: A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.

公开(公告)号：US10820448B2

公开(公告)日：2020-10-27

申请号：US16458711

申请日：2019-07-01

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US09872416B2

公开(公告)日：2018-01-16

申请号：US15435711

申请日：2017-02-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Youhe Ke ,  Yuping Hong ,  Mingliang Hao

IPC: H05K7/20 ,  H04W88/08 ,  H04Q1/02 ,  H04B10/2575

CPC classification number: H05K7/20145 ,  H04B10/25752 ,  H04Q1/035 ,  H04W88/085

Abstract: The present invention discloses a communications product (100), including a remote radio module (10) and a mounting kit (30), where the mounting kit (30) includes a fastening part (32), the fastening part (32) is configured to mount and fasten the remote radio module (10) to a holder, the mounting kit (30) further includes a ventilation part (34) and an air supply part (36), an air source is disposed inside the air supply part (36), the ventilation part (34) is connected between the fastening part (32) and the air supply part (36), a ventilation channel is disposed inside the ventilation part (34), and the ventilation channel allows the air supply part (36) to communicate with the remote radio module (10), so that an air flow generated by the air source reaches the remote radio module (10) after passing through the ventilation channel, to dissipate heat for the remote radio module.

公开(公告)号：US11330737B2

公开(公告)日：2022-05-10

申请号：US17079408

申请日：2020-10-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US20160057888A1

公开(公告)日：2016-02-25

申请号：US14828321

申请日：2015-08-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuping Hong ,  Chenglong Wang ,  Mingliang Hao ,  Youhe Ke

IPC: H05K7/20 ,  H04B1/036

CPC classification number: H05K7/20145 ,  H04B1/036 ,  H05K7/20572

Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.

Abstract translation: 一种通信产品，包括至少一个RRU和风扇组件，其中所述风扇组件独立于所述至少一个RRU，并且与所述至少一个RRU并排设置，风道布置在所述风扇组件和 RRU，并且气流从风扇组件通过空气管道，并到达至少一个RRU，以消散至少一个RRU的热量。 本公开的通信产品可以确保散热能力，并且还可以允许RRU的尺寸小。 本公开还提供了一种包括通信产品的基站系统。

公开(公告)号：US12207447B2

公开(公告)日：2025-01-21

申请号：US18151566

申请日：2023-01-09

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yuping Hong ,  Xiaowei Hui ,  Meng Wang

IPC: H05K7/20

Abstract: A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board. A communication device that includes the heat sink is also provided.

公开(公告)号：US20210045263A1

公开(公告)日：2021-02-11

申请号：US17079408

申请日：2020-10-23

Applicant: HUAWEI TECHNOLOGIES CO.,LTD.

Inventor： Xiaowei Hui ,  Yuping Hong ,  Wei Chen

IPC: H05K7/20

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

公开(公告)号：US09451725B2

公开(公告)日：2016-09-20

申请号：US14828321

申请日：2015-08-17

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yuping Hong ,  Chenglong Wang ,  Mingliang Hao ,  Youhe Ke

IPC: H05K7/20 ,  H04B1/036

CPC classification number: H05K7/20145 ,  H04B1/036 ,  H05K7/20572

Abstract: A communications product, including at least one RRU and a fan assembly, where the fan assembly is independent of the at least one RRU, and is disposed side by side with the at least one RRU, an air duct is disposed between the fan assembly and the RRU, and an airflow passes, from the fan assembly, through the air duct, and arrives at the at least one RRU, to dissipate heat of the at least one RRU. The communications product of the present disclosure can ensure a heat-dissipation capability, and also can allow the RRU to be small in size. The present disclosure further provides a base station system that includes the communications product.

Abstract translation: 一种通信产品，包括至少一个RRU和风扇组件，其中所述风扇组件独立于所述至少一个RRU，并且与所述至少一个RRU并排设置，风道布置在所述风扇组件和 RRU，并且气流从风扇组件通过空气管道，并到达至少一个RRU，以消散至少一个RRU的热量。 本公开的通信产品可以确保散热能力，并且还可以允许RRU的尺寸小。 本公开还提供了一种包括通信产品的基站系统。