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公开(公告)号：US11284537B2
公开(公告)日：2022-03-22
申请号：US17031040
申请日：2020-09-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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Patent Agency Ranking
公开(公告)号：US20220256739A1
公开(公告)日：2022-08-11
申请号：US17683698
申请日：2022-03-01
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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公开(公告)号：US11839055B2
公开(公告)日：2023-12-05
申请号：US17683698
申请日：2022-03-01
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
CPC classification number: H05K7/20336 , H04M1/026 , H05K7/205 , G06F1/203 , H04M1/02
Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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公开(公告)号：US20210007238A1
公开(公告)日：2021-01-07
申请号：US17031040
申请日：2020-09-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
Abstract: A heat-conducting assembly is described, the assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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公开(公告)号：US11864350B2
公开(公告)日：2024-01-02
申请号：US17631256
申请日：2020-07-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
CPC classification number: H05K7/20336 , H05K5/0017 , H05K7/2099
Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
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公开(公告)号：US20220279683A1
公开(公告)日：2022-09-01
申请号：US17631256
申请日：2020-07-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Jian Shi , Jie Yang , Linfang Jin , Zhen Sun
Abstract: A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.
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