公开(公告)号：US20210392782A1

公开(公告)日：2021-12-16

申请号：US17284381

申请日：2019-09-25

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongwang Xiao ,  Linfang Jin ,  Hualin Li ,  Naixiang Xu ,  Guoping Wang

IPC: H05K7/20

Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly. The first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.

公开(公告)号：US20240081026A1

公开(公告)日：2024-03-07

申请号：US18505673

申请日：2023-11-09

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yongwang Xiao ,  Linfang Jin ,  Hualin Li ,  Naixiang Xu ,  Guoping Wang

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/203 ,  H05K7/20481 ,  H04M1/026

Abstract: Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly, where the first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.