公开(公告)号：US09518849B2

公开(公告)日：2016-12-13

申请号：US14928543

申请日：2015-10-30

Applicant: HYUNDAI MOTOR COMPANY

Inventor： Hui Sung Lee ,  Kwang Myung Oh ,  Sung Jin Sah ,  Sung-Min Park

IPC: G01D11/24

CPC classification number: G01D11/245 ,  G01D11/30 ,  G01N29/14 ,  G01N29/223 ,  G01N29/28 ,  G01N2291/101

Abstract: An acoustic sensor apparatus mounted to a medium is disclosed. The acoustic sensor apparatus includes: a sensor unit processing an input acoustic signal; and a housing including a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit formed to mechanically couple the body unit or the cap unit to a medium.

Abstract translation: 公开了一种安装在介质上的声学传感器装置。 声学传感器装置包括：处理输入声信号的传感器单元; 以及壳体，包括具有容纳所述传感器单元的容纳槽的主体单元，形成为封闭所述容纳槽的开口的盖单元和形成为将所述主体单元或所述盖单元机械地联接到介质的联接单元 。

公开(公告)号：US20160209249A1

公开(公告)日：2016-07-21

申请号：US14928543

申请日：2015-10-30

Applicant: HYUNDAI MOTOR COMPANY

Inventor： Hui Sung Lee ,  Kwang Myung Oh ,  Sung Jin Sah ,  Sung-Min Park

IPC: G01D11/24

CPC classification number: G01D11/245 ,  G01D11/30 ,  G01N29/14 ,  G01N29/223 ,  G01N29/28 ,  G01N2291/101

Abstract: An acoustic sensor apparatus mounted to a medium is disclosed. The acoustic sensor apparatus includes: a sensor unit processing an input acoustic signal; and a housing including a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit formed to mechanically couple the body unit or the cap unit to a medium.

Abstract translation: 公开了一种安装在介质上的声学传感器装置。 声学传感器装置包括：处理输入声信号的传感器单元; 以及壳体，包括具有容纳所述传感器单元的容纳槽的主体单元，形成为封闭所述容纳槽的开口的盖单元和形成为将所述主体单元或所述盖单元机械地联接到介质的联接单元 。

公开(公告)号：US09524936B2

公开(公告)日：2016-12-20

申请号：US14712776

申请日：2015-05-14

Applicant: HYUNDAI MOTOR COMPANY

Inventor： Sung-Min Park

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/528 ,  H01L23/495

CPC classification number: H01L23/5283 ,  H01L21/565 ,  H01L23/3142 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A power semiconductor module may include a first device and a second device spaced apart from the first device at a predetermined interval. A first assembling terminal is fixedly disposed between the first device and the second device to be a first connection terminal. A second assembling terminal is fixedly assembled to contact outer surfaces of the first device and the second device to be a second connection terminal.

Abstract translation: 功率半导体模块可以包括以预定间隔与第一器件间隔开的第一器件和第二器件。 第一组装端子被固定地设置在第一设备和第二设备之间以成为第一连接端子。 第二组装端子被固定地组装以接触第一装置和第二装置的外表面以成为第二连接端子。