公开(公告)号：US20240324146A1

公开(公告)日：2024-09-26

申请号：US18735565

申请日：2024-06-06

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Jia ,  Gaoliang Xia ,  Dingfang Li

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20254 ,  H05K7/20272

Abstract: A device node is provided. The device node includes a circuit board, a heat dissipation component and a housing having a cold liquid inlet and a liquid return outlet. The circuit board and the heat dissipation component are disposed in the housing, and at least one main chip is disposed on the circuit board. The heat dissipation component includes a spray plate and at least one liquid cold plate. Each liquid cold plate is configured to form a liquid cooling channel. Liquid cooling channels of all liquid cold plates are communicated to form a liquid cooling network. An inlet of the liquid cooling network is communicated with the cold liquid inlet. The spray plate has a spray channel communicated with an outlet of the liquid cooling network and liquid spray holes communicated with the spray channel, and a liquid outlet end of the liquid spray hole faces the circuit board.

公开(公告)号：US11641725B2

公开(公告)日：2023-05-02

申请号：US17708657

申请日：2022-03-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui Jia

IPC: H05K7/20 ,  F28F3/02

Abstract: Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

公开(公告)号：US20220087050A1

公开(公告)日：2022-03-17

申请号：US17538881

申请日：2021-11-30

Applicant: HUAWEI TECHNOLOGIES CO.,LTD.

Inventor： Hui Jia ,  Jiyang Li ,  Chao Wang

IPC: H05K7/20

Abstract: A heat dissipation apparatus is provided. The heat dissipation apparatus includes an immersion tank. The immersion tank accommodates a liquid medium. When being used, the board is immersed in the liquid medium, and the liquid medium dissipates heat for the board by absorbing heat. The heat dissipation apparatus further includes a condenser immersed in the liquid medium. The condenser is disposed to dissipate heat for the liquid medium. Heat of the board is transferred to the condenser in the immersion tank by using the liquid medium in the immersion tank as a medium. Then the condenser takes away and dissipates the heat by using a cooling apparatus that is connected to the condenser and that is configured to perform heat exchange for the condenser.

公开(公告)号：US20220248571A1

公开(公告)日：2022-08-04

申请号：US17727241

申请日：2022-04-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Jia ,  Junfeng Ding ,  Chengjian Wang

IPC: H05K7/20

Abstract: This application provides a liquid cooling heat dissipation system, which includes a control unit, a heat source box, and a heat dissipation unit. A temperature sensing unit is installed in the heat source box, and the temperature sensing unit and the control unit are connected for signal transmission. The heat dissipation unit includes an inlet and an outlet. Coolant flows into the heat dissipation unit through the inlet and flows out of the heat dissipation unit through the outlet. A flow regulating valve is disposed on a pipe at the inlet, and the flow regulating valve and the control unit are connected for signal transmission. The control unit obtains temperature information by using the temperature sensing unit, and determines lowest temperature T1 and highest temperature T2 based on the temperature information. The control unit is configured to control an opening degree of the flow regulating valve.

公开(公告)号：US12238853B2

公开(公告)日：2025-02-25

申请号：US18191946

申请日：2023-03-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui Jia ,  Xinhu Gong ,  Dingfang Li

IPC: H05K1/02

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.

公开(公告)号：US11310935B2

公开(公告)日：2022-04-19

申请号：US16685019

申请日：2019-11-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui Jia

IPC: H05K7/20 ,  F28F3/02

Abstract: Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.