公开(公告)号：US20220399192A1

公开(公告)日：2022-12-15

申请号：US17775427

申请日：2019-11-22

Applicant: HANWHA CORPORATION

Inventor： Su Woong KIM ,  Dong Won SEO ,  Jae Wook CHOI ,  Sang Bo KIM ,  Sang Yoon MOON ,  Han Young KONG ,  Seung Dae CHOI ,  Baek Ju LEE ,  Jae Soon HWANG

IPC: H01J37/32 ,  H05K3/00 ,  C23C16/455 ,  C23C16/458

Abstract: A substrate processing device according to an embodiment of the present invention includes a disk part disposed in a chamber in which a heating means is provided, and a pocket part installed on one surface of the disk part and on which a substrate is seated. A heat hole through which heat generated by the heating means passes may be formed on an installation surface of the disk part on which the pocket part is installed, or a gear hole through which the heat of the heating means passes may be formed in a pocket gear facing the disk part.