FLEXIBLE FILAMENT SPLICING STRUCTURES

    公开(公告)号:US20240379576A1

    公开(公告)日:2024-11-14

    申请号:US18655306

    申请日:2024-05-05

    Abstract: The embodiments of the present disclosure provide a flexible filament splicing structure, comprising a plurality of flexible filaments. Each of the plurality of flexible filaments includes a flexible substrate and at least one LED chip. The flexible substrate is provided with a conductive circuit layer. The at least one LED chip is disposed on the flexible substrate. The at least one LED chip is electrically connected with the conductive circuit layer. Two adjacent flexible filaments are electrically spliced with each other to enable the plurality of flexible filaments to form an integrated spliced structure.

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