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公开(公告)号：US11128957B2
公开(公告)日：2021-09-21
申请号：US15769798
申请日：2015-10-21
Applicant: Goertek Inc.
Inventor： Quanbo Zou , Zhe Wang , Jun Li
IPC: H04R17/00 , H04R31/00 , H01L41/083 , H01L41/29 , H04R1/02
Abstract: A micro-speaker, the manufacturing method thereof, a speaker device and an electronic apparatus are described herein. The micro-speaker comprises a case, wherein the case has an opening; and a piezoelectric layer, wherein one or more electrodes are provided on the piezoelectric layer, and wherein the piezoelectric layer is pre-buckled in its rest position, wherein the piezoelectric layer covers the opening and is bonded onto the case, to form a speaker rear cavity together with the case. The micro-speaker of the present invention has a relatively low speaker profile.
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公开(公告)号：US20180317017A1
公开(公告)日：2018-11-01
申请号：US15769798
申请日：2015-10-21
Applicant: Goertek Inc.
Inventor： Quanbo Zou , Zhe Wang , Jun Li
IPC: H04R17/00 , H04R1/02 , H01L41/29 , H04R31/00 , H01L41/083
CPC classification number: H04R17/00 , H04R31/00 , H04R2201/003 , H04R2201/401 , H04R2307/025 , H04R2499/11 , H04R2499/15
Abstract: A micro-speaker, the manufacturing method thereof, a speaker device and an electronic apparatus are described herein. The micro-speaker comprises a case, wherein the case has an opening; and a piezoelectric layer, wherein one or more electrodes are provided on the piezoelectric layer, and wherein the piezoelectric layer is pre-buckled in its rest position, wherein the piezoelectric layer covers the opening and is bonded onto the case, to form a speaker rear cavity together with the case. The micro-speaker of the present invention has a relatively low speaker profile.
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公开(公告)号：US11974094B2
公开(公告)日：2024-04-30
申请号：US16475506
申请日：2017-03-03
Applicant: Goertek, Inc.
Inventor： Junkai Zhan , Jun Li , Mengjin Cai
CPC classification number: H04R19/04 , H04R7/04 , H04R19/005 , H04R2201/003
Abstract: A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.
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公开(公告)号：US20230199406A1
公开(公告)日：2023-06-22
申请号：US16475506
申请日：2017-03-03
Applicant: Goertek, Inc.
Inventor： Junkai Zhan , Jun Li , Mengjin Cai
CPC classification number: H04R19/04 , H04R7/04 , H04R19/005 , H04R2201/003
Abstract: A MEMS microphone is provided, comprising a substrate having a back cavity, and a plate capacitor structure arranged on the substrate, the plate capacitor structure being formed by a vibration diaphragm, a backplate and a support portion; wherein a pressure relief device is provided in the vibration diaphragm, a pressure maintaining channel is formed between the vibration diaphragm and the backplate; and the pressure relief device in the vibration diaphragm constitutes an inlet of the pressure maintaining channel.
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