PHOTON-COUNTING CT-SYSTEM WITH REDUCED DETECTOR COUNTING-RATE REQUIREMENTS
    1.
    发明申请
    PHOTON-COUNTING CT-SYSTEM WITH REDUCED DETECTOR COUNTING-RATE REQUIREMENTS 有权
    具有减少检测器计数速率要求的光电计数CT系统

    公开(公告)号:US20140177786A1

    公开(公告)日:2014-06-26

    申请号:US13724376

    申请日:2012-12-21

    Abstract: Various of the disclosed embodiments contemplate systems and methods that compensate for the limited dynamic range of certain X-Ray detector systems, such as CAT-Scan detector systems. In some embodiments, the system alternates between different photon emission flux values and then gives more consideration to an attenuation value associated with a more favorable detection flux. In this manner, different object densities may be accounted for and may be more properly imaged despite the particular characteristics of the X-Ray system.

    Abstract translation: 各种公开的实施例考虑了补偿某些X射线检测器系统(例如CAT扫描检测器系统)的有限动态范围的系统和方法。 在一些实施例中,系统在不同的光子发射通量值之间交替,然后更多地考虑与更有利的检测通量相关联的衰减值。 以这种方式,可以考虑不同的物体密度,并且可以更适当地成像,尽管X射线系统具有特定的特征。

    Apparatus and Method for Low Capacitance Packaging for Direct Conversion X-Ray or Gamma Ray Detector
    3.
    发明申请
    Apparatus and Method for Low Capacitance Packaging for Direct Conversion X-Ray or Gamma Ray Detector 审中-公开
    用于直接转换X射线或γ射线检测器的低电容封装的装置和方法

    公开(公告)号:US20140348290A1

    公开(公告)日:2014-11-27

    申请号:US13901198

    申请日:2013-05-23

    CPC classification number: G01N23/046 G01T1/244

    Abstract: A direct-conversion X-ray detector includes one or more detector modules. The detector modules can include a substrate, one or more sensor tiles, and one or more photon-counting application specific integrated circuit (ASIC). The substrate has a dielectric constant of less than about 3.5 and is capable of lithographic conductor patterning with feature sizes of about 5 um or less. The one or more X-ray direct conversion sensor tiles have an array of one or more electrodes electrically coupled to a first surface of the substrate. The one or more ASICs are electrically coupled to the substrate and disposed laterally along the substrate with respect to the one or more direct conversion sensor tiles. Conductive lines are spaced along the substrate and are configured to electrically couple the one or more X-ray direct conversion sensor tiles to the one or more ASICs.

    Abstract translation: 直接转换X射线检测器包括一个或多个检测器模块。 检测器模块可以包括基板,一个或多个传感器瓦片以及一个或多个光子计数专用集成电路(ASIC)。 该基片具有小于约3.5的介电常数,并且能够具有大约5um或更小的特征尺寸的平版印刷导体图案化。 一个或多个X射线直接转换传感器瓦片具有电耦合到基板的第一表面的一个或多个电极的阵列。 一个或多个ASIC电耦合到衬底并相对于一个或多个直接转换传感器瓦片沿着衬底横向设置。 导电线沿着衬底间隔开并且被配置为将一个或多个X射线直接转换传感器瓦片电耦合到一个或多个ASIC。

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