公开(公告)号：US11107790B2

公开(公告)日：2021-08-31

申请号：US16555060

申请日：2019-08-29

Applicant: Electronics and Telecommunications Research Institute

Inventor： Kwang-Seong Choi ,  Yong Sung Eom ,  KeonSoo Jang ,  Seok-Hwan Moon ,  Hyun-cheol Bae

IPC: H01L23/00

Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.