Temperature sensor and Thermal, Flow Measuring Device
    2.
    发明申请
    Temperature sensor and Thermal, Flow Measuring Device 有权
    温度传感器和热量,流量测量装置

    公开(公告)号:US20150276503A1

    公开(公告)日:2015-10-01

    申请号:US14436933

    申请日:2013-09-23

    Abstract: A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The circuit board is arranged in the housing chamber. The circuit board is positioned in the housing chamber by a snap-in connection. A connection wire of a first temperature sensor element is led with strain relief in a first direction through the circuit board and connected with such. The housing chamber contains at least a first elastic body. The circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of the circuit board. Also presented is a thermal, flow measuring device.

    Abstract translation: 一种温度传感器,包括壳体,壳体具有壳体和壳体腔室,其中壳体最终布置有两个温度传感器元件,其特别体现为薄膜电阻温度计,其中一个温度传感器元件是可加热的, 温度传感器元件,至少一个连接线导线远离,其与电路板连接。 电路板布置在容纳室中。 电路板通过卡扣连接定位在壳体室中。 第一温度传感器元件的连接线通过电路板沿着第一方向被应变消除引导并与之连接。 容纳室至少包含第一弹性体。 电路板具有第一数量的空腔,用于连接连接线和/或电缆以及第二数量的空腔,用于减少电路板的热膨胀。 还提出了一种热流量测量装置。

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