公开(公告)号：US20250133652A1

公开(公告)日：2025-04-24

申请号：US18532182

申请日：2023-12-07

Applicant: Cisco Technology, Inc.

Inventor： Yuqing Zhu ,  Wenbin Ma ,  Mike Sapozhnikov ,  Weiying Ding ,  Mingjian Gao ,  Mingtong Zuo ,  David Nozadze ,  Joel Richard Goergen

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K3/40

Abstract: In some embodiments, an apparatus includes a layer of a printed circuit board (PCB), a pair of signal vias formed on the layer of the PCB and including a first signal via a second signal via each configured to propagate a respective signal, a first plurality of ground vias formed on the layer and at least partially circumferentially surrounding the first signal via of the pair of signal vias, and a second plurality of ground vias formed on the layer and at least partially circumferentially surrounding the second signal via of the pair of signal vias. The first plurality of ground vias and the second plurality of ground vias include a shared ground via.