公开(公告)号：US12238856B2

公开(公告)日：2025-02-25

申请号：US17503000

申请日：2021-10-15

Applicant: Cisco Technology, Inc.

Inventor： Paul Ton ,  Yaotsan Tsai

IPC: H05K1/02 ,  H01L23/473 ,  H05K7/20

Abstract: A heat sink component includes a cold plate including a first surface configured to engage a circuit component and a second surface opposing the first surface, and a plurality of fins extending transversely from the second surface of the cold plate. The first surface includes a non-planar surface portion and a planar surface portion surrounding the non-planar surface portion. The non-planar surface portion of the cold plate provides an adaptive contour to complement a surface of a circuit component that experiences thermal warpage due to change in temperature during operation.

公开(公告)号：US20230118952A1

公开(公告)日：2023-04-20

申请号：US17503000

申请日：2021-10-15

Applicant: Cisco Technology, Inc.

Inventor： Paul Ton ,  Yaotsan Tsai

IPC: H05K1/02 ,  H05K7/20

Abstract: A heat sink component includes a cold plate including a first surface configured to engage a circuit component and a second surface opposing the first surface, and a plurality of fins extending transversely from the second surface of the cold plate. The first surface includes a non-planar surface portion and a planar surface portion surrounding the non-planar surface portion. The non-planar surface portion of the cold plate provides an adaptive contour to complement a surface of a circuit component that experiences thermal warpage due to change in temperature during operation.