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公开(公告)号:US11367791B2
公开(公告)日:2022-06-21
申请号:US16473456
申请日:2018-09-05
Applicant: BOE Technology Group Co., Ltd.
Inventor: Zhaohui Qiang , Jianhua Du , Feng Guan , Chunhao Li
IPC: H01L29/786 , H01L27/12
Abstract: The present disclosure provides a thin film transistor, a fabricating method thereof, an array substrate, and a display device. The thin film transistor includes: a substrate; a channel region; a heavily doped first semiconductor pattern located on both sides of the channel region; a second semiconductor pattern disposed on the heavily doped first semiconductor pattern; a gate insulating layer covering the channel region and the second semiconductor pattern; a gate pattern disposed on the gate insulating layer, an orthographic projection of the gate pattern on the substrate being within an orthographic projection of the channel region on the substrate; and a source pattern and a drain pattern in contact with the heavily doped first semiconductor pattern through the first via and the second via, respectively.
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2.
公开(公告)号:US20200381560A1
公开(公告)日:2020-12-03
申请号:US16473456
申请日:2018-09-05
Applicant: BOE Technology Group Co., Ltd.
Inventor: Zhaohui Qiang , Jianhua Du , Feng Guan , Chunhao Li
IPC: H01L29/786 , H01L27/12
Abstract: The present disclosure provides a thin film transistor, a fabricating method thereof, an array substrate, and a display device. The thin film transistor includes: a substrate; a channel region; a heavily doped first semiconductor pattern located on both sides of the channel region; a second semiconductor pattern disposed on the heavily doped first semiconductor pattern; a gate insulating layer covering the channel region and the second semiconductor pattern; a gate pattern disposed on the gate insulating layer, an orthographic projection of the gate pattern on the substrate being within an orthographic projection of the channel region on the substrate; and a source pattern and a drain pattern in contact with the heavily doped first semiconductor pattern through the first via and the second via, respectively.
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