公开(公告)号：US20240258070A1

公开(公告)日：2024-08-01

申请号：US18104108

申请日：2023-01-31

Applicant: Applied Materials, Inc.

Inventor： Michael Andrew STEARNS ,  Kartik RAMASWAMY ,  Carlaton WONG

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/32174 ,  H01J2237/3344

Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.

公开(公告)号：US20240266152A1

公开(公告)日：2024-08-08

申请号：US18107487

申请日：2023-02-08

Applicant: Applied Materials, Inc.

Inventor： Michael Andrew STEARNS ,  Alok RANJAN ,  Kartik RAMASWAMY ,  Peng TIAN ,  Timothy Joseph FRANKLIN ,  Chris BLANK ,  Carlaton WONG

IPC: H01J37/32 ,  H01F27/28 ,  H01L21/3065

CPC classification number: H01J37/3266 ,  H01F27/28 ,  H01J37/3211 ,  H01L21/3065 ,  H01J2237/0264 ,  H01J2237/3341 ,  H01J2237/3343

Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a concentric coil region comprising a first concentric coil and a second concentric coil, and a power supply circuit coupled to the first concentric coil and the second concentric coil. The first concentric coil may include a first coil with a diameter measured in a direction parallel to a first plane that is smaller than the diameter of a second coil included in the second concentric coil. The power supply circuit may be configured to bias the first concentric coil and the second concentric coil to adjust a generated magnetic field in a region of control of a plasma in the plasma processing chamber to control a plasma density of the plasma.