公开(公告)号：US20240363315A1

公开(公告)日：2024-10-31

申请号：US18307931

申请日：2023-04-27

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Lu LIU ,  Toan Q. TRAN ,  Daniel NGUYEN

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32697 ,  H01J37/32724 ,  H01L21/6833 ,  H01J2237/2007 ,  H01J2237/20235 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/3321 ,  H01J2237/3327

Abstract: Aspects of the present disclosure generally relate to apparatus and methods for an adjustable de-chucking voltage associated with an electrostatically charged substrate in a processing chamber. An example method of de-chucking a substrate disposed in a process chamber includes processing a substrate in a chamber body, the substrate being coupled to a substrate support comprising a chucking electrode. The method further includes monitoring a property associated with a lift pin assembly movable relative to the chucking electrode via an actuator. The method further includes adjusting a first voltage level applied to the chucking electrode in response to the property associated with the lift pin assembly satisfying one or more criteria.