公开(公告)号：US09033716B2

公开(公告)日：2015-05-19

申请号：US13952935

申请日：2013-07-29

Applicant: Apple Inc.

Inventor： Jason Sloey ,  Varun Sehrawat

IPC: H01R12/00 ,  H01R12/50 ,  H05K1/11

CPC classification number: H01R23/722 ,  H01R12/52 ,  H01R12/716 ,  H01R12/73 ,  H01R13/2414 ,  H05K1/11 ,  H05K1/111 ,  H05K1/147 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/10189

Abstract: Contact pads on structures such as printed circuits may be coupled to each other using printed circuit connectors such as board-to-board connectors. A printed circuit connector may have interlocking metal frame structures. The metal frame structures may be soldered to traces on the printed circuits. Rectangular openings in the metal frame structures may receive a rectangular contact array structure that is separate from the metal frame structures. The contact array structure may include a dielectric carrier structure and an array of conductive contacts. The dielectric carrier structure may align the contacts with respect to pads on the printed circuits to which the metal frame structures are soldered. The contacts may be formed from metal spring structures or conductive elastomeric structures that are compressed between respective printed circuit contact pads when the metal frame structures of a printed circuit connector are attached to each other.

Abstract translation: 诸如印刷电路的结构上的接触垫可以使用诸如板对板连接器的印刷电路连接器彼此耦合。 印刷电路连接器可以具有互锁的金属框架结构。 金属框架结构可以焊接到印刷电路上的迹线。 金属框架结构中的矩形开口可以接收与金属框架结构分开的矩形接触阵列结构。 接触阵列结构可以包括介电载体结构和导电接触阵列。 电介质载体结构可以使触点相对于金属框架结构被焊接到的印刷电路上的焊盘进行对准。 触点可以由金属弹簧结构或导电弹性体结构形成，当印刷电路连接器的金属框架结构彼此附接时，金属弹簧结构或导电弹性体结构被压缩在相应的印刷电路接触垫之间。

公开(公告)号：US20150031221A1

公开(公告)日：2015-01-29

申请号：US13952935

申请日：2013-07-29

Applicant: Apple Inc.

Inventor： Jason Sloey ,  Varun Sehrawat

IPC: H01R12/50 ,  H05K1/11

CPC classification number: H01R23/722 ,  H01R12/52 ,  H01R12/716 ,  H01R12/73 ,  H01R13/2414 ,  H05K1/11 ,  H05K1/111 ,  H05K1/147 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/10189

Abstract: Contact pads on structures such as printed circuits may be coupled to each other using printed circuit connectors such as board-to-board connectors. A printed circuit connector may have interlocking metal frame structures. The metal frame structures may be soldered to traces on the printed circuits. Rectangular openings in the metal frame structures may receive a rectangular contact array structure that is separate from the metal frame structures. The contact array structure may include a dielectric carrier structure and an array of conductive contacts. The dielectric carrier structure may align the contacts with respect to pads on the printed circuits to which the metal frame structures are soldered. The contacts may be formed from metal spring structures or conductive elastomeric structures that are compressed between respective printed circuit contact pads when the metal frame structures of a printed circuit connector are attached to each other.

Abstract translation: 诸如印刷电路的结构上的接触垫可以使用诸如板对板连接器的印刷电路连接器彼此耦合。 印刷电路连接器可以具有互锁的金属框架结构。 金属框架结构可以焊接到印刷电路上的迹线。 金属框架结构中的矩形开口可以接收与金属框架结构分开的矩形接触阵列结构。 接触阵列结构可以包括介电载体结构和导电接触阵列。 电介质载体结构可以使触点相对于金属框架结构被焊接到的印刷电路上的焊盘进行对准。 触点可以由金属弹簧结构或导电弹性体结构形成，当印刷电路连接器的金属框架结构彼此附接时，金属弹簧结构或导电弹性体结构被压缩在相应的印刷电路接触垫之间。