公开(公告)号：US20220366278A1

公开(公告)日：2022-11-17

申请号：US17320978

申请日：2021-05-14

Applicant: Apple Inc.

Inventor： Jia Liu ,  Aditya Singh Tomar ,  Kushal M. Chawda ,  Sumit Saxena

IPC: G06N5/04 ,  G06N20/00

Abstract: Systems and methods for configuring hardware resources of an electronic device based on operating characteristics of the electronic device are provided. In one embodiment, a processor may configure the hardware resources of the electronic device that equally weighs decisions made by a machine learning (ML) engine and a finite state machine (FSM) engine. In another embodiment, the processor may configure the hardware resources of the electronic device that gives greater weight to decisions made by the ML engine compared to decisions made by the FSM engine. In yet another embodiment, the processor may configure the hardware resources of the electronic device that gives greater weight to decisions made by the FSM engine compared to decisions made by the ML engine.

公开(公告)号：US20240251357A1

公开(公告)日：2024-07-25

申请号：US18157651

申请日：2023-01-20

Applicant: Apple Inc.

Inventor： Jia Liu

IPC: H04W52/14 ,  H04W52/34

CPC classification number: H04W52/146 ,  H04W52/34

Abstract: An electronic device may include wireless circuitry having a modem that conveys data over a data path and that is operable using a dynamic voltage and frequency management (DVFM) profile. A resource and state manager (RSM) may adjust the DVFM profile based on L1, L2, L3, and/or IPC parameters. A routine track may generate a first profile based on an L1 parameter such as DL MAC TB size and may generate a second profile based on an L2 parameter such as UL pre-build size. A protective track may independently generate a third profile based on a performance event along the data path. The RSM may aggregate the preferred profiles to update the current DVFM profile in a manner that optimizes efficiency while ensuring that a sufficiently high DVFM profile is used at any given time without consuming unnecessary power.

公开(公告)号：US20240098167A1

公开(公告)日：2024-03-21

申请号：US18364855

申请日：2023-08-03

Applicant: Apple Inc.

Inventor： Lee E Hooton ,  Jia Liu ,  Paul Choiniere ,  Daniel W Jarvis

IPC: H04M1/02

CPC classification number: H04M1/0264 ,  H04M1/0268 ,  H04M1/0277

Abstract: Electronic devices may be provided with components such as displays and cameras. A display may be mounted in a housing. The housing may have a sidewall. A bent portion of the display may be embedded in epoxy that is separated from the sidewall by an air gap. Adhesive may attach the epoxy to the housing. A metal support that is chemically bonded to the epoxy may be welded to metal structures such as camera brackets and other metal supports. The housing may have a glass layer that forms a rear wall. The glass layer may have a protruding portion that forms a glass plateau with openings through which cameras operates. A camera may have a protruding portion that is received within one of the glass plateau openings. The protruding portion may extend into a metal camera trim in one of the openings that is attached to the glass plateau.

公开(公告)号：US12079036B2

公开(公告)日：2024-09-03

申请号：US17340893

申请日：2021-06-07

Applicant: Apple Inc.

Inventor： Daniel J. Barrett ,  Dakota A. Bass ,  Sameer Pandya ,  Shang L Tsuei ,  Elizabeth C. Porter ,  Erik G. de Jong ,  Jingjing Xu ,  Jacquelynn M. Pok ,  Kiran S. Pillai ,  Xuan Liu ,  Adam J. Brinkman ,  Paul Choiniere ,  Daniel W. Jarvis ,  Jia Liu

IPC: G06F1/16

CPC classification number: G06F1/1652 ,  G06F1/163

Abstract: An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. The tail may be coupled to a printed circuit on which a display driver integrated circuit and/or other circuitry is mounted. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in a molded polymer member. The molded polymer member may be attached to the housing with adhesive and may directly contact an inner surface of the display cover layer.

公开(公告)号：US20240241548A1

公开(公告)日：2024-07-18

申请号：US18618749

申请日：2024-03-27

Applicant: Apple Inc.

Inventor： Daniel J. Barrett ,  Dakota A. Bass ,  Sameer Pandya ,  Shang L. Tsuei ,  Elizabeth C. Porter ,  Erik G. de Jong ,  Jingjing Xu ,  Jacquelynn M. Pok ,  Kiran S. Pillai ,  Xuan Liu ,  Adam J. Brinkman ,  Paul Choiniere ,  Daniel W. Jarvis ,  Jia Liu

IPC: G06F1/16

CPC classification number: G06F1/1652 ,  G06F1/163

Abstract: An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. The tail may be coupled to a printed circuit on which a display driver integrated circuit and/or other circuitry is mounted. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in a molded polymer member. The molded polymer member may be attached to the housing with adhesive and may directly contact an inner surface of the display cover layer.