公开(公告)号：US11914201B2

公开(公告)日：2024-02-27

申请号：US17750082

申请日：2022-05-20

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Alfredo Bismuto

IPC: G02B6/42

CPC classification number: G02B6/423 ,  G02B6/4262

Abstract: A multi-chip photonic assembly includes first and second photonic integrated circuits having first and second waveguides vertically stacked such that first vertical dimensions of the first and second waveguides occupy different horizontal planes in the stack. At least one of the first and second waveguides has a region that has a second vertical dimension that is larger than the first vertical dimension and either horizontally overlaps the other waveguide and/or vertically contacts the other waveguide. Light moving through one of the waveguides from the first vertical dimension to the other vertical dimension changes modes vertically so that the light moves from one waveguide to the other.

公开(公告)号：US20230102967A1

公开(公告)日：2023-03-30

申请号：US17850828

申请日：2022-06-27

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Alfredo Bismuto ,  Jeffrey T. Hill ,  Junkyo Suh ,  Yigit O. Yilmaz

IPC: G02B6/42

Abstract: A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.

公开(公告)号：US12204155B2

公开(公告)日：2025-01-21

申请号：US17850828

申请日：2022-06-27

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Alfredo Bismuto ,  Jeffrey T. Hill ,  Junkyo Suh ,  Yigit O. Yilmaz

IPC: G02B6/42

Abstract: A photonic integrated circuit including multiple elements formed by different processes onto separate chips can be manufactured by defining, via photolithography processes for example, complementary geometries onto each separate chip. Thereafter, the complementary geometries can be aligned and engaged, thereby optically and mechanically intercoupling the several chips to define a single photonic integrated circuit.

公开(公告)号：US20240280767A1

公开(公告)日：2024-08-22

申请号：US18440193

申请日：2024-02-13

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Jeffrey T. Hill ,  Yipin Wu ,  Zhechao Wang

IPC: G02B6/42

CPC classification number: G02B6/423

Abstract: An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.

公开(公告)号：US20230089758A1

公开(公告)日：2023-03-23

申请号：US17949066

申请日：2022-09-20

Applicant: Apple Inc.

Inventor： Yongming Tu ,  Jeremy D. Witmer ,  Huiyang Deng ,  Mark A. Arbore ,  Mohsen Kamandar Dezfouli ,  Alfredo Bismuto ,  Petr Markov

IPC: G02B6/12 ,  G02B6/122

Abstract: Configurations for an optical system used for guiding light and reducing back-reflection back in an output waveguide is disclosed. The optical system may include an output waveguide defined in a slab waveguide. The output waveguide may terminate before an output side of the slab waveguide, which may reduce the back-reflection of light from the output side back into the output waveguide. The output side may define an optical element that may steer the output light. The optical element may collimate the output light, cause the output light to converge, or cause the output light to diverge.

公开(公告)号：US20240094466A1

公开(公告)日：2024-03-21

申请号：US17949096

申请日：2022-09-20

Applicant: Apple Inc.

Inventor： Mark A. Arbore ,  Mohsen Kamandar Dezfouli ,  Yongming Tu ,  Jeremy D. Witmer ,  Huiyang Deng ,  Alfredo Bismuto ,  Petr Markov

IPC: G02B6/124

CPC classification number: G02B6/124 ,  G02B2006/12107

Abstract: Configurations for an optical system used for guiding light and reducing back-reflection back in an output waveguide is disclosed. The optical system may include an output waveguide defined in a slab waveguide. The output waveguide may terminate before an output side of the slab waveguide, which may reduce the back-reflection of light from the output side back into the output waveguide. The output side may define an optical element that may steer the output light. The optical element may collimate the output light, cause the output light to converge, or cause the output light to diverge.

公开(公告)号：US20230087293A1

公开(公告)日：2023-03-23

申请号：US17949079

申请日：2022-09-20

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Mark A. Arbore ,  Yongming Tu ,  Huiyang Deng ,  Mohsen Kamandar Dezfouli ,  Alfredo Bismuto ,  Petr Markov

IPC: G02B6/12 ,  G02B6/122

Abstract: Configurations for an optical system used for guiding light and reducing back-reflection back in an output waveguide is disclosed. The optical system may include an output waveguide defined in a slab waveguide. The output waveguide may terminate before an output side of the slab waveguide, which may reduce the back-reflection of light from the output side back into the output waveguide. The output side may define an optical element that may steer the output light. The optical element may collimate the output light, cause the output light to converge, or cause the output light to diverge.

公开(公告)号：US20230085761A1

公开(公告)日：2023-03-23

申请号：US17750082

申请日：2022-05-20

Applicant: Apple Inc.

Inventor： Jeremy D. Witmer ,  Alfredo Bismuto

IPC: G02B6/42

Abstract: A multi-chip photonic assembly includes first and second photonic integrated circuits having first and second waveguides vertically stacked such that first vertical dimensions of the first and second waveguides occupy different horizontal planes in the stack. At least one of the first and second waveguides has a region that has a second vertical dimension that is larger than the first vertical dimension and either horizontally overlaps the other waveguide and/or vertically contacts the other waveguide. Light moving through one of the waveguides from the first vertical dimension to the other vertical dimension changes modes vertically so that the light moves from one waveguide to the other.