公开(公告)号：US10120423B1

公开(公告)日：2018-11-06

申请号：US14849350

申请日：2015-09-09

Applicant: Amazon Technologies, Inc.

Inventor： Bradley David Urban ,  Troy Hulick ,  Shelomon Patrick Doblack ,  Robert Olson ,  Albert John Yu Sam Chua ,  Daniel Jones ,  Adam Kenneth Cybart ,  Gaurav Soni ,  William James Carter-Giannini ,  Matthew Michael Seflic

IPC: H05K7/20 ,  G06F1/20 ,  B29C65/00 ,  B29L9/00

Abstract: Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.

公开(公告)号：US09664577B1

公开(公告)日：2017-05-30

申请号：US14469436

申请日：2014-08-26

Applicant: Amazon Technologies, Inc.

Inventor： Edward Albert Liljegren ,  Angeles Marcia Almanza-Workman ,  Anna Kim Lee ,  Robert Olson ,  Jung Sik Yang

IPC: G01L1/00 ,  G01L1/22 ,  G06F3/041 ,  G06F3/045

CPC classification number: G01L1/2287 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/045 ,  G06F2203/04105

Abstract: A force-sensitive resistor (FSR) assembly includes first and second electrically insulative substrates. The first substrate includes a first top surface and a first bottom surface. The second substrate includes a second top surface and a second bottom surface. The first substrate is positioned such that the first bottom surface is disposed facing the second top surface. The FSR assembly also includes thermoset ink disposed between the first substrate and the second substrate.