公开(公告)号：US11226415B1

公开(公告)日：2022-01-18

申请号：US17020010

申请日：2020-09-14

Applicant: Amazon Technologies, Inc.

Inventor： Fubin Song ,  Jun Ge ,  Jianhua Du ,  Ke Guo ,  Chaoran Yang

IPC: G01S17/86 ,  G01S7/481 ,  H04N13/254 ,  H04N5/225

Abstract: Systems, methods, and computer-readable media are disclosed for camera modules having integrated time of flight sensors. In one embodiment, an integrated sensor module may include a substrate, a molding compound disposed on the substrate, and a camera sensor disposed on the substrate. The integrated sensor module may include a vertical-cavity surface-emitting laser assembly (VCSEL) disposed on the molding compound and separated from the substrate by a first distance, and a single photon avalanche photodiode assembly (SPAD) disposed on the molding compound and separated from the substrate by the first distance. The camera sensor may be configured to detect a first portion of light emitted by the VCSEL and reflected from an object, and the SPAD may be configured to detect a second portion of light emitted by the VCSEL and reflected from the object.