Process for forming polysilicon layer and fabrication of thin film transistor by the process
    1.
    发明申请
    Process for forming polysilicon layer and fabrication of thin film transistor by the process 审中-公开
    用于形成多晶硅层和通过该工艺制造薄膜晶体管的工艺

    公开(公告)号:US20040106240A1

    公开(公告)日:2004-06-03

    申请号:US10410041

    申请日:2003-04-08

    CPC classification number: H01L29/66757 H01L29/78621 H01L29/78675

    Abstract: A process for forming a polysilicon layer. First, an amorphous silicon layer is formed. Next, the amorphous silicon layer is pre-treated such that a surface of the amorphous silicon layer is oxidized to a silicon oxide layer or nitridized to a silicon nitride layer. Next, the amorphous silicon layer is crystallized to form a polysilicon layer. TFT fabricated by the present invention has smaller Vt and higher electron mobility.

    Abstract translation: 一种形成多晶硅层的工艺。 首先,形成非晶硅层。 接下来,非晶硅层被预处理,使得非晶硅层的表面被氧化成氧化硅层或氮化成氮化硅层。 接下来,非晶硅层被结晶以形成多晶硅层。 通过本发明制造的TFT具有更小的Vt和更高的电子迁移率。

    Method and system of beam energy control
    2.
    发明申请
    Method and system of beam energy control 审中-公开
    光束能量控制的方法和系统

    公开(公告)号:US20040241889A1

    公开(公告)日:2004-12-02

    申请号:US10751238

    申请日:2003-12-30

    CPC classification number: H01L21/02667 H01L21/2026

    Abstract: A method and system of automatic beam energy control. First, a substrate is provided. Next, hydrogen content of the substrate is measured to determine whether hydrogen content exceeds a critical hydrogen content limit. A warning is issued when hydrogen content exceeds a critical hydrogen content limit. Substrate thickness is measured when hydrogen content does not exceed a critical hydrogen content limit. A database comprising a plurality of beam energy values individually absorbed by substrates of different thicknesses is provided. An appropriate beam energy level corresponding to the measured thickness is provided by the database. Finally, beam energy is delivered to the substrate accordingly.

    Abstract translation: 自动光束能量控制的方法和系统。 首先,提供基板。 接下来,测量衬底的氢含量以确定氢含量是否超过临界氢含量极限。 当氢含量超过临界氢含量限制时,会发出警告。 当氢含量不超过临界氢含量极限时,测量基板厚度。 提供了包括由不同厚度的基板单独吸收的多个光束能量值的数据库。 由数据库提供与测量厚度对应的适当的光束能级。 最后,光束能量被相应地传送到衬底。

    Apparatus and method for inspecting crystal quality of a polysilicon film
    3.
    发明申请
    Apparatus and method for inspecting crystal quality of a polysilicon film 审中-公开
    用于检查多晶硅膜的晶体质量的装置和方法

    公开(公告)号:US20040115337A1

    公开(公告)日:2004-06-17

    申请号:US10607607

    申请日:2003-06-27

    CPC classification number: G01N21/55 G01N21/9501 H01L21/268

    Abstract: A method for inspecting crystal quality of a polysilicon film. First, a substrate covered by a polysilicon layer is provided. Next, a probe light beam having a predetermined wavelength is irradiated through a beam splitter to separate into a first light beam and a second light beam, which is used for irradiating the polysilicon layer. Thereafter, the light intensity of the first light beam and the light intensity of the second light beam reflected from the polysilicon layer are detected to achieve a light intensity ratio. Finally, crystal quality of the polysilicon layer is monitored by the light intensity ratio. An apparatus for inspecting crystal quality of a polysilicon film and the method for controlling the same are also disclosed.

    Abstract translation: 一种用于检查多晶硅膜的晶体质量的方法。 首先,提供被多晶硅层覆盖的基板。 接下来,通过分束器照射具有预定波长的探测光束,以分离成用于照射多晶硅层的第一光束和第二光束。 此后,检测第一光束的光强度和从多晶硅层反射的第二光束的光强度以实现光强度比。 最后,通过光强比监测多晶硅层的晶体质量。 还公开了一种用于检查多晶硅膜的晶体质量的装置及其控制方法。

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