公开(公告)号：US20220244649A1

公开(公告)日：2022-08-04

申请号：US17623829

申请日：2020-06-10

Applicant: ASML NETHERLANDS B.V.

Inventor： Pieter Gerardus Jacobus SMORENBERG ,  Putra SAPUTRA ,  Paul DERWIN ,  Khalid ELBATTAY

IPC: G03F7/20

Abstract: A method for determining an intra-field correction for control of a lithographic apparatus configured for exposing a pattern on an exposure field of a substrate, the method includes: obtaining metrology data for use in determining the intra-field correction; determining an accuracy metric indicating a lower accuracy where the metrology data is not reliable and/or where the lithographic apparatus is limited in actuating a potential actuation input which is based on the metrology data; and determining the intra-field correction based at least partially on the accuracy metric.

公开(公告)号：US20220171295A1

公开(公告)日：2022-06-02

申请号：US17441353

申请日：2020-03-05

Applicant: ASML NETHERLANDS B.V.

Inventor： Rowin MEIJERINK ,  Putra SAPUTRA ,  Pieter Gerardus Jacobus SMORENBERG ,  Theo Wilhelmus Maria THIJSSEN ,  Khalid ELBATTAY ,  Ma Su Su HLAING ,  Paul DERWIN ,  BO ZHONG ,  Masaya KOMATSU

IPC: G03F7/20

Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.

公开(公告)号：US20220260920A1

公开(公告)日：2022-08-18

申请号：US17612601

申请日：2020-05-11

Applicant: ASML NETHERLANDS B.V.

Inventor： Pieter Gerardus Jacobus SMORENBERG ,  Putra SAPUTRA ,  Khalid ELBATTAY ,  Paul DERWIN ,  Roy WERKMAN ,  Erik JENSEN ,  Hyunwoo YU ,  Gautam SARMA

IPC: G03F7/20

Abstract: A method for determining a sampling scheme, the method including: obtaining a first fingerprint model relating to a first spatial distribution of a performance parameter over a first portion of a semiconductor substrate and a second fingerprint model relating to a second spatial distribution of the performance parameter over a second portion of the semiconductor substrate; and determining a sampling point corresponding to a measuring location on the semiconductor substrate for generating measurement data based on an expected reduction of a first uncertainty metric associated with evaluation of the first fingerprint model over the first portion and an expected reduction of a second uncertainty metric associated with evaluation of the second fingerprint model over the second portion.

公开(公告)号：US20210080837A1

公开(公告)日：2021-03-18

申请号：US16954384

申请日：2018-11-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Manouk RIJPSTRA ,  Cornelis Johannes Henricus LAMBREGTS ,  Wim Tjibbo TEL ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA ,  Chi-Fei NIEN ,  Weitian KOU ,  Chang-Wei CHEN ,  Pieter Gerardus Jacobus SMORENBERG

IPC: G03F7/20 ,  G05B19/404

Abstract: A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.

公开(公告)号：US20240045340A1

公开(公告)日：2024-02-08

申请号：US18242842

申请日：2023-09-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Peter TEN BERGE ,  Steven Erik STEEN ,  Pieter Gerardus Jacobus SMORENBERG ,  Khalid ELBATTAY

IPC: G03F7/00

CPC classification number: G03F7/70525

Abstract: A method for controlling a process of manufacturing semiconductor devices, the method including: obtaining a first control grid associated with a first lithographic apparatus used for a first patterning process for patterning a first substrate; obtaining a second control grid associated with a second lithographic apparatus used for a second patterning process for patterning a second substrate; based on the first control grid and second control grid, determining a common control grid definition for a bonding step for bonding the first substrate and second substrate to obtain a bonded substrate; obtaining bonded substrate metrology data including data relating to metrology performed on the bonded substrate; and determining a correction for performance of the bonding step based on the bonded substrate metrology data, the determining a correction including determining a co-optimized correction for the bonding step and for the first patterning process and/or second patterning process.

公开(公告)号：US20230288817A1

公开(公告)日：2023-09-14

申请号：US18196432

申请日：2023-05-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Rowin MEIJERINK ,  Putra SAPUTRA ,  Pieter Gerardus Jacobus SMORENBERG ,  Theo Wilhelmus Maria THIJSSEN ,  Khalid ELBATTAY ,  Ma Su Su HLAING ,  Paul DERWIN ,  Bo ZHONG ,  Masaya KOMATSU

IPC: G03F7/20

CPC classification number: G03F7/70633 ,  G03F7/70258 ,  G03F7/70725

Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.

公开(公告)号：US20220365446A1

公开(公告)日：2022-11-17

申请号：US17874582

申请日：2022-07-27

Applicant: ASML NETHERLANDS B.V.

Inventor： Manouk RIJPSTRA ,  Cornelis Johannes Henricus LAMBREGTS ,  Wim Tjibbo TEL ,  Sarathi ROY ,  Cédric Désiré GROUWSTRA ,  Chi-Fei NIEN ,  Weitian KOU ,  Chang-Wei CHEN ,  Pieter Gerardus Jacobus SMORENBERG

IPC: G03F7/20

Abstract: A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.

公开(公告)号：US20200278614A1

公开(公告)日：2020-09-03

申请号：US16762982

申请日：2018-11-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy WERKMAN ,  Bijoy RAJASEKHARAN ,  Lydia Marianna VERGAIJ-HUIZER ,  Jochem Sebastiaan WILDENBERG ,  Ronald VAN ITTERSUM ,  Pieter Gerardus Jacobus SMORENBERG ,  Robertus Wilhelmus VAN DER HEIJDEN ,  Xiuhong WEI ,  Hadi YAGUBIZADE

IPC: G03F7/20

Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.