公开(公告)号：US20210398778A1

公开(公告)日：2021-12-23

申请号：US16906875

申请日：2020-06-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Junghoon KIM ,  Tae Seung CHO ,  Dmitry LUBOMIRSKY ,  Toan TRAN

IPC: H01J37/32

Abstract: Methods and apparatus for processing a substrate are herein described. For example, a processing chamber for processing a substrate includes a chamber body defining a processing volume; a radio frequency (RF) power source configured to deliver RF energy to the processing volume for processing a substrate; a substrate support comprising an electrode; an AC power supply configured to supply power to the processing chamber; an RF filter circuit connected between the electrode and the AC power supply; and a controller configured to monitor an RF voltage at the RF filter circuit that is indirectly induced into the electrode by the RF power source during operation, and to determine a processing state in the processing volume based on the monitored RF voltage