公开(公告)号：US20210057244A1

公开(公告)日：2021-02-25

申请号：US16545537

申请日：2019-08-20

Applicant: APPLIED MATERIALS, INC.

Inventor： VINODH RAMACHANDRAN ,  ANANTHKRISHNA JUPUDI ,  CHENG-HSIUNG TSAI ,  YUEH SHENG OW ,  PREETHAM P. RAO ,  RIBHU GAUTAM ,  PRASHANT AGARWAL

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/66 ,  H05B6/64

Abstract: Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.