公开(公告)号：US20140111929A1

公开(公告)日：2014-04-24

申请号：US13869605

申请日：2013-04-24

Applicant: APPLE INC.

Inventor： Bartley K. ANDRE ,  Brandon S. SMITH ,  Charles A. SCHWALBACH ,  Gavin J. REID ,  Houtan R. FARAHANI ,  Zheng GAO ,  Michael D. McBROOM ,  Hilbert T. KWAN ,  Joss N. GIDDINGS

IPC: G06F1/16

CPC classification number: G06F1/1656

Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The portable computing device can include a case snap system configured to movably attach two portions of a base of the computing device together. The portable computing device can include a lid portion with a support structure having a shaped profile configured to support a display. The portable computing device can include locating features disposed within the base portion configured to locate internal components.

Abstract translation: 本申请描述了关于用于提供具有薄型材的轻便且耐用的便携式计算设备的系统和方法的各种实施例。 便携式计算设备可以采用膝上型计算机的形式。 便携式计算设备可以包括被配置为将计算设备的基座的两部分可移动地连接在一起的壳体卡扣系统。 便携式计算设备可以包括具有支撑结构的盖部分，该支撑结构具有被配置为支撑显示器的成形轮廓。 便携式计算设备可以包括设置在配置成定位内部组件的基础部分内的定位特征。

公开(公告)号：US20160342179A1

公开(公告)日：2016-11-24

申请号：US15160054

申请日：2016-05-20

Applicant: Apple Inc.

Inventor： Steven J. OSBORNE ,  Joss N. GIDDINGS ,  Adam T. GARELLI ,  William F. LEGGETT ,  Sarah J. MONTPLAISIR ,  Eric T. CORRIVEAU ,  Tyler J. EWING

IPC: G06F1/16

CPC classification number: G06F1/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/106 ,  B23K20/227 ,  B23K20/2275 ,  B23K20/233 ,  B23K20/2336 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/18 ,  G06F1/1633

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract translation: 公开了将电子设备的外壳中的结构特征结合在一起的技术。 结构特征可以被超声波焊接到外壳以提供结构支撑并在该装置内形成磁路。 此外，超声波焊接可以将各种特征粘合到外壳的内部区域，而不会在对应于各种特征的位置处留下标记或迹线到外壳的外部区域。 此外，一个或多个特征可以被驱动以抵靠外壳，以通过摩擦焊接来接合一个或多个特征。 此外，旋转摩擦焊接机可以将具有相对较小直径的特征以相对较高的速度旋转到外壳上，以将特征驱动到外壳中，并将该特征与外壳摩擦焊接。 此外，摩擦焊接在外部区域上不会留下任何外观的化妆品变形。