公开(公告)号：US09389029B2

公开(公告)日：2016-07-12

申请号：US14077550

申请日：2013-11-12

Applicant: Apple Inc.

Inventor： Ihtesham H. Chowdhury ,  Henry H. Lam ,  Derek W. Wright ,  Amaury J. Heresztyn

IPC: H05K7/20 ,  F28F21/06 ,  H01L23/373 ,  H01L23/433 ,  G06F1/20 ,  F28F21/02 ,  F28F13/00

CPC classification number: F28F21/06 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/02 ,  G06F1/203 ,  H01L23/373 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Abstract translation: 电子设备可以包括位于产生热量的第一部件和散发热量的第二部件之间的传热结构。 传热结构将热量从第一部件传递到第二部件。 传热结构可以包括传热构件，其包括附接到至少一个柔性层的导热层和由传热构件的形状产生的至少一个可变形区域。

公开(公告)号：US20150092351A1

公开(公告)日：2015-04-02

申请号：US14077550

申请日：2013-11-12

Applicant: APPLE INC.

Inventor： Ihtesham H. Chowdhury ,  Henry H. Lam ,  Derek W. Wright ,  Amaury J. Heresztyn

IPC: H05K7/20 ,  F28F21/06 ,  F28F21/02

CPC classification number: F28F21/06 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/02 ,  G06F1/203 ,  H01L23/373 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

Abstract translation: 电子设备可以包括位于产生热量的第一部件和散发热量的第二部件之间的传热结构。 传热结构将热量从第一部件传递到第二部件。 传热结构可以包括传热构件，其包括附接到至少一个柔性层的导热层和由传热构件的形状产生的至少一个可变形区域。