Sensor assembly for electronic device

    公开(公告)号:US11228846B2

    公开(公告)日:2022-01-18

    申请号:US16792043

    申请日:2020-02-14

    Applicant: Apple Inc.

    Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.

    MAGNETIC ASSEMBLY
    6.
    发明申请
    MAGNETIC ASSEMBLY 审中-公开
    磁性装配

    公开(公告)号:US20150179324A1

    公开(公告)日:2015-06-25

    申请号:US14643123

    申请日:2015-03-10

    Applicant: Apple Inc.

    CPC classification number: H01F7/0263 G06F1/1626 G06F2200/1634 H05K9/0075

    Abstract: A magnetic assembly for use in a housing of an electronic device can include a first and a second magnet and a magnetic shield. The magnetic shield can reduce magnetic flux density from the first and the second magnets that can appear on the outside of the housing. A magnetic hinge assembly can include magnets configured to correlate with the first and second magnets. The magnetic hinge can magnetically attach to the housing by cooperating with the first and second magnets with magnets that can be included in the magnetic hinge.

    Abstract translation: 用于电子设备的壳体的磁性组件可以包括第一和第二磁体和磁屏蔽。 磁屏蔽可以降低出现在壳体外部的第一和第二磁体的磁通密度。 磁性铰链组件可以包括配置成与第一和第二磁体相关联的磁体。 磁性铰链可以通过与可以包括在磁性铰链中的磁体与第一和第二磁体配合来磁耦合到壳体。

Patent Agency Ranking