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    Coil component
    1.
    发明授权
    Coil component 有权
    线圈组件

    公开(公告)号：US07508292B2

    公开(公告)日：2009-03-24

    申请号：US11979445

    申请日：2007-11-02

    Applicant: Tomonaga Nishikawa ,  Tomokazu Ito ,  Makoto Yoshida ,  Hiroshi Kamiyama

    Inventor： Tomonaga Nishikawa ,  Tomokazu Ito ,  Makoto Yoshida ,  Hiroshi Kamiyama

    IPC: H01F5/00

    CPC classification number: H01F17/0013 ,  H01F27/323 ,  H01F2017/002 ,  H01F2017/0093 ,  H03H2001/0092

    Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

    Abstract translation: 本发明涉及具有用于将它们安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装型线圈部件，并提供具有高电特性的线圈部件。 共模滤波器包括形成为螺旋形状的线圈导体，作为切断面对的线圈导体的部分的切端，以及形成为使得绝缘膜插入在线圈导体与其之间的桥导体，以将 相互切割。

    Coil component
    2.
    发明申请
    Coil component 有权
    线圈组件

    公开(公告)号：US20080100409A1

    公开(公告)日：2008-05-01

    申请号：US11907603

    申请日：2007-10-15

    Applicant: Tomonaga Nishikawa ,  Tomokazu Ito ,  Makoto Yoshida ,  Hiroshi Kamiyama

    Inventor： Tomonaga Nishikawa ,  Tomokazu Ito ,  Makoto Yoshida ,  Hiroshi Kamiyama

    IPC: H01F5/00

    CPC classification number: H01F17/0006 ,  H01F17/0013 ,  H01F27/027 ,  H01F27/292 ,  H01F27/323 ,  H03H2001/0092

    Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

    Abstract translation: 本发明涉及具有用于将它们安装在印刷电路板或混合IC（HIC）上的安装表面的表面安装型线圈部件，并提供具有低直流电阻的低成本线圈部件。 共模滤波器包括桥式导体层，该桥式导体层的一端连接到引线的一端并且另一端连接到线圈导体的内圆周端，桥式导体的一端 其连接到另一个引线的一端，另一端连接到另一个线圈导体的内圆周端，桥导体层形成在两个线圈导体层之间，绝缘膜置于桥导体层和每个导体层之间 的线圈导体层。

    Coil component and method of manufacturing the same
    3.
    发明授权
    Coil component and method of manufacturing the same 有权
    线圈部件及其制造方法

    公开(公告)号：US08564393B2

    公开(公告)日：2013-10-22

    申请号：US13293841

    申请日：2011-11-10

    Applicant: Tomonaga Nishikawa ,  Makoto Yoshida ,  Tomokazu Ito ,  Hiroshi Kamiyama ,  Takeshi Okumura ,  Sho Nakagomi

    Inventor： Tomonaga Nishikawa ,  Makoto Yoshida ,  Tomokazu Ito ,  Hiroshi Kamiyama ,  Takeshi Okumura ,  Sho Nakagomi

    IPC: H01F5/00 ,  H01F27/30 ,  H01F27/28 ,  H01F7/06 ,  H01L27/08

    CPC classification number: H01F27/292 ,  H01F17/0013

    Abstract: A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.

    Abstract translation: 线圈部件100设置有基板11，设置在基板11上的薄膜线圈层12，设置在薄膜线圈层12的表面上的第一和第二凸起电极13a，13b，第一引线导体20 与第一和第二凸块电极13a，13b一起设置在薄膜线圈层12的表面上并与第一凸起电极13a一体形成，以及设置在第一凸起电极13a和第二凸起电极之间的绝缘体层14 13b。 薄膜线圈层12包含作为平面线圈图案的第一螺旋导体16。 第一突起电极13a经由第一引线导体20与第一螺旋导体16的内周端连接。第二突起电极13b与第一螺旋导体16的外周端连接。

    ELECTRONIC COMPONENT
    4.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20120133472A1

    公开(公告)日：2012-05-31

    申请号：US13294627

    申请日：2011-11-11

    Applicant: Tomonaga NISHIKAWA ,  Makoto YOSHIDA ,  Tomokazu ITO ,  Hiroshi KAMIYAMA ,  Takeshi OKUMURA ,  Tsuneo KUWAHARA

    Inventor： Tomonaga NISHIKAWA ,  Makoto YOSHIDA ,  Tomokazu ITO ,  Hiroshi KAMIYAMA ,  Takeshi OKUMURA ,  Tsuneo KUWAHARA

    IPC: H01F5/00

    CPC classification number: H01F17/04 ,  H01F27/292 ,  H01F41/042

    Abstract: An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

    Abstract translation: 电子部件设置有基板，设置在基板上的薄膜元件层，设置在薄膜元件层的表面上的第一和第二突起电极，以及设置在第一突起电极和第二突起电极之间的绝缘体层 第二凸起电极。 薄膜元件层包含作为平面线圈图案的第一螺旋导体。 第一凸起电极连接到第一螺旋导体的内周端。 第二凸起电极连接到第一螺旋导体的外周端。 第一和第二凸起电极都具有暴露于绝缘体层的主表面的第一曝光表面和暴露于绝缘体层的端面的第二曝光表面。

    COMMON MODE CHOKE COIL AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    COMMON MODE CHOKE COIL AND MANUFACTURING METHOD THEREOF 有权
    共用模式选择线圈及其制造方法

    公开(公告)号：US20090066462A1

    公开(公告)日：2009-03-12

    申请号：US12196464

    申请日：2008-08-22

    Applicant: Tomokazu ITO ,  Tomonaga NISHIKAWA

    Inventor： Tomokazu ITO ,  Tomonaga NISHIKAWA

    IPC: H01F5/00 ,  H01F7/06

    CPC classification number: H01F17/0013 ,  H01F5/04 ,  H01F41/042 ,  H01F41/046 ,  H01F2017/0093 ,  Y10T29/4902

    Abstract: A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short.

    Abstract translation: 共模扼流线圈包括形成在树脂绝缘层上的两个引出导体，并且在树脂绝缘层之间的一个区域中形成凹部，该第一部分覆盖有一个引出导体，第二部分覆盖有另一个提取 导体。 上部树脂绝缘层嵌入凹部内。 因此，由于树脂绝缘层在形成提取导体的部分中不是平坦的，所以提取导体之间距树脂绝缘层表面的距离增加。 因此，由于沿着绝缘层的表面离子迁移而产生的电流路径几乎不形成，因此即使提取导体之间的距离短，也能获得高的耐受电压。

    Electronic component and manufacturing method of electronic component
    7.
    发明授权
    Electronic component and manufacturing method of electronic component 有权
    电子元件的电子元件及其制造方法

    公开(公告)号：US08174349B2

    公开(公告)日：2012-05-08

    申请号：US12621194

    申请日：2009-11-18

    Applicant: Makoto Yoshida ,  Hiroshi Kamiyama ,  Tomonaga Nishikawa

    Inventor： Makoto Yoshida ,  Hiroshi Kamiyama ,  Tomonaga Nishikawa

    IPC: H01F5/00 ,  H01F27/28 ,  H01L21/66 ,  H01L23/12

    CPC classification number: H01F27/292 ,  H01F27/027 ,  H01F41/046 ,  H01G4/224 ,  H01G4/33 ,  Y10T29/4913

    Abstract: A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

    Abstract translation: 电子部件的制造方法包括在基板上形成第一绝缘层，在所述第一绝缘层上形成多个无源元件，在所述无源元件上形成第二绝缘层，形成与各自被动电连接的多个导体层 元件，在第二绝缘层的外侧暴露于每个电子部件的上表面，以及在包括各个无源元件的电子部件之间形成凹槽，以暴露每个电子部件的侧表面和导体层的部分 每个电子元件的侧面。 该制造方法还包括在暴露于每个电子部件的上表面和侧表面的各个导体层上电镀多个外部电极，并且将基板切割成完全分离为各个电子部件。

    Common mode choke coil and manufacturing method thereof
    8.
    发明授权
    Common mode choke coil and manufacturing method thereof 有权
    共模扼流圈及其制造方法

    公开(公告)号：US07646280B2

    公开(公告)日：2010-01-12

    申请号：US12196464

    申请日：2008-08-22

    Applicant: Tomokazu Ito ,  Tomonaga Nishikawa

    Inventor： Tomokazu Ito ,  Tomonaga Nishikawa

    IPC: H01F5/00

    CPC classification number: H01F17/0013 ,  H01F5/04 ,  H01F41/042 ,  H01F41/046 ,  H01F2017/0093 ,  Y10T29/4902

    Abstract: A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short.

    Abstract translation: 共模扼流线圈包括形成在树脂绝缘层上的两个引出导体，并且在树脂绝缘层之间的一个区域中形成凹部，该第一部分覆盖有一个引出导体，第二部分覆盖有另一个提取 导体。 上部树脂绝缘层嵌入凹部内。 因此，由于树脂绝缘层在形成提取导体的部分中不是平坦的，所以提取导体之间距树脂绝缘层表面的距离增加。 因此，由于沿着绝缘层的表面离子迁移而产生的电流路径几乎不形成，因此即使提取导体之间的距离短，也能获得高的耐受电压。

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