公开(公告)号：US20090111299A1

公开(公告)日：2009-04-30

申请号：US11866728

申请日：2007-10-31

申请人： Michael J. Domitrovits ,  Raymond F. Frizzell, JR. ,  Wai Mon Ma ,  Cheikhou O. Ndiaye ,  Nandakumar N. Ranadive

发明人： Michael J. Domitrovits ,  Raymond F. Frizzell, JR. ,  Wai Mon Ma ,  Cheikhou O. Ndiaye ,  Nandakumar N. Ranadive

IPC分类号： H01R12/00 ,  B23K1/20 ,  B23K31/02

CPC分类号： H01R43/0249 ,  B23K1/0016 ,  B23K2101/40 ,  H01R43/0235 ,  H01R43/0256 ,  H05K3/3426 ,  H05K3/3484 ,  H05K2201/10189 ,  H05K2201/10984 ,  Y02P70/613

摘要： A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.

摘要翻译： 一种用于制造的连接器和方法，其中连接器具有连接器主体，从连接器主体延伸用于焊接连接到电子电路的连接器引线，其中连接器引线不延伸与主体连接器主体的均匀距离。 在每个连接器引线上形成焊膏，将其模版到不能焊接到焊膏上的平板上。 焊膏由具有第一较低熔点的第一焊料颗粒和具有第二较高熔点的第二焊料颗粒组成。 将焊膏加热到第一熔点，以将焊膏粘附到连接器引线上，同时用平板平坦化焊料覆盖的电引线。 通过去除平板并将焊膏加热到第二较高熔点，将连接器引线焊接到电路。

公开(公告)号：US5524132A

公开(公告)日：1996-06-04

申请号：US439737

申请日：1995-05-12

申请人： Nandakumar N. Ranadive

发明人： Nandakumar N. Ranadive

IPC分类号： G01B15/02 ,  G01T1/29 ,  G01B15/06

CPC分类号： G01B15/025 ,  G01T1/2012

摘要： A process and apparatus for revealing manufacturing defects in testpieces, such as printed circuit boards, by passing through high-intensity attenuated x-rays (above 150 Kilo-Volts) to reusable photo plates for revealing defects in the testpieces. The x-rays are angled from 35 to 50 degrees for generating images of defects within thick multilayered printed circuit boards. During exposure, a thin lead sheet is placed between the testpiece and a phosphor photographic plate on a side of the testpeice opposite the x-ray gun. The lead sheet uniformly attenuates the high-energy x-rays to the captured image before they reach the phosphor plate to avoid damage to the photographic reuse of the plate and prevent over-exposure without loss of image contrast in the phosphor photograph. The exposed phosphor plate is excited with a low energy monochromatic radiation to visually activate the latent x-ray image in the exposed plate. The activated image is received by an analog-to-digital converter which digitizes the image into digital signals that are formed into a data file. The data file of the digitized image is stored in a digital computer for display on a computer display device. Then, the image is erased by an ultra-violet lamp, and the phosphor plate is reused for later photographs of other boards. The data file provides a permanent way to maintain the visual quality of the x-ray captured image which would otherwise rapidly deteriorate.

摘要翻译： 用于通过将高强度衰减的X射线（大于150千伏特）穿过可再利用的照相板来显示试件中的缺陷的用于揭示诸如印刷电路板的试样中的制造缺陷的方法和装置。 x射线从35度到50度成角度，用于在厚的多层印刷电路板内产生缺陷图像。 在曝光期间，将薄的引线片放置在与X射线枪相对的睾丸侧面的试件和​​荧光体照相板之间。 引线片在到达荧光板之前将高能X射线均匀地衰减到捕获的图像，以避免损坏印版的照相重复使用，并防止过度曝光而不损失荧光体照片中的图像对比度。 暴露的荧光体板被低能量单色辐射激发，以目视激活暴露​​板中的潜在X射线图像。 激活的图像由模数转换器接收，该数字转换器将图像数字化为形成数据文件的数字信号。 数字化图像的数据文件存储在数字计算机中以在计算机显示装置上显示。 然后，通过紫外灯擦除图像，并将磷光体板再次用于其它板的后续照片。 数据文件提供了维持X射线捕获图像的视觉质量的永久方式，否则会迅速恶化。