发明申请
US20090111299A1 Surface Mount Array Connector Leads Planarization Using Solder Reflow Method
审中-公开
表面贴装阵列连接器使用焊料回流法实现平面化
- 专利标题： Surface Mount Array Connector Leads Planarization Using Solder Reflow Method
- 专利标题（中）： 表面贴装阵列连接器使用焊料回流法实现平面化
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申请号： US11866728申请日： 2007-10-31
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公开(公告)号： US20090111299A1公开(公告)日： 2009-04-30
- 发明人: Michael J. Domitrovits , Raymond F. Frizzell, JR. , Wai Mon Ma , Cheikhou O. Ndiaye , Nandakumar N. Ranadive
- 申请人： Michael J. Domitrovits , Raymond F. Frizzell, JR. , Wai Mon Ma , Cheikhou O. Ndiaye , Nandakumar N. Ranadive
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01R12/00
- IPC分类号： H01R12/00 ; B23K1/20 ; B23K31/02
摘要：
A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.
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