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公开(公告)号：US20250081692A1
公开(公告)日：2025-03-06
申请号：US18028467
申请日：2022-05-27
Inventor： Honghao YU , Yutao HAO , Donglei LI , Ying CHEN , Jie GAO , Jiaxin LI , Pei QIN , Lili JIA
Abstract: Provided are a light emitting substrate, a method for manufacturing same, and a display apparatus. The light emitting substrate includes a base substrate; a plurality of light emitting units located at a side of the base substrate; a plurality of protective structures located at a side of the plurality of light emitting units facing away from the base substrate; the plurality of protective structures each covers a respective one of the plurality of light emitting units; and a plurality of reflective patterns located at a side of the plurality of protective structures facing away from the plurality of light emitting units; orthographic projections of the plurality of reflective patterns on the base substrate fall within orthographic projections of the plurality of protective structures on the base substrate.
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公开(公告)号：US20250078691A1
公开(公告)日：2025-03-06
申请号：US18283821
申请日：2022-10-31
Inventor： Jianbai TAN , Jiaxing YUAN , Shaofei GUO , Shipeng WANG , Chao TIAN , Jianfeng WANG , Yushu GAN
Abstract: A transmission adjustment structure includes: a shell, a rotation part, a transmission part, and a response part. An adjustment hole exposing one end of the rotation part is provided at a position on the shell corresponding to the rotation part, the other end of the rotation part is connected to the transmission part; a guide hole exposing one end of the response part is provided at a position on the shell corresponding to the response part, the other end of the response part is in contact with the transmission part; the rotation part is rotatable in response to controlling by an external tool on the end of the rotation part exposed by the adjustment hole; the transmission part is movable along a first direction in response to rotation controlling of the rotation part, the first direction is an extension direction of the transmission part.
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公开(公告)号：US12199072B2
公开(公告)日：2025-01-14
申请号：US17254807
申请日：2019-11-05
Inventor： Jinpeng Li , Ming Zhai , Pei Li , Zhiyuan Wang , Pengjun Cao , Jian Li , Teng Zhang , Zijian Wang , Chiachiang Lin
IPC: H01L25/075 , H01L25/16 , H01L33/58 , H01L33/62
Abstract: An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.
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公开(公告)号：US20240428720A1
公开(公告)日：2024-12-26
申请号：US18290837
申请日：2023-01-19
Inventor： Junwei ZHANG , Wei HAO , Lingyun SHI , Xiaoyu ZHANG
Abstract: The present disclosure provides a driving chip, which includes: a first signal port and a second signal port; a logic control module connected to the first signal port and the second signal port, the logic control module being configured to configure, according to a configuration signal received by the first signal port or the second signal port, one of the first signal port or the second signal port as a signal input port, configure the other of the first signal port or the second signal port as a signal output port, and output the configuration signal or an updated configuration signal through the signal output port. The present disclosure further provides a method for configuring ports of the driving chip, a light emission driver, a backlight module and a display apparatus.
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公开(公告)号：US20240428711A1
公开(公告)日：2024-12-26
申请号：US18263378
申请日：2022-07-14
Inventor： Wei HAO , Junwei ZHANG , Xiaoyu ZHANG , Lingyun SHI
Abstract: A driver chip is disclosed. The driver chip includes: a logic control module, at least one output pin and a first functional pin. The at least one output pin is electrically connected to the logic control module, and the first functional pin is electrically connected to the logic control module. The first functional pin is capable of receiving a test signal, and the logic control module is configured to generate, according to the test signal, a test current flowing through each output pin.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20240405179A1
公开(公告)日：2024-12-05
申请号：US18697192
申请日：2022-08-11
IPC: H01L33/62 , H01L25/075 , H01L33/40
Abstract: A display panel includes a substrate, first bonding electrodes, connecting leads, an electrode carrier plate and second bonding electrodes. The substrate includes a display surface, a non-display surface, and a selected side face. The display surface includes a first bonding area, and the non-display surface includes a second bonding area. The first bonding electrodes are arranged side by side at the intervals in the first bonding area. The connecting leads are arranged side by side at intervals, each connecting lead includes a first portion, a second portion and a third portion, and the first portion of each connecting lead is electrically connected to a first bonding electrode. The electrode carrier plate is arranged on the non-display surface and provided thereon with the second bonding electrodes arranged side by side at intervals, and each second bonding electrode is electrically connected to a third portion of a connecting lead.
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公开(公告)号：US12154464B2
公开(公告)日：2024-11-26
申请号：US17504531
申请日：2021-10-19
Inventor： Shaofei Guo , Shipeng Wang , Zhonghua Li , Yiping Ruan
Abstract: A display module and a tiled display device are provided. The display module includes a driving backboard and a heat dissipation component, wherein the driving backboard includes an underlaying substrate and a driving circuit disposed on the underlaying substrate, the underlaying substrate is provided with a flexible printed circuit board connected with the driving circuit, and the heat dissipation component is provided with an adapter component connected with the flexible printed circuit board, and the adapter component includes a pluggable connector.
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公开(公告)号：US20240322082A1
公开(公告)日：2024-09-26
申请号：US18733213
申请日：2024-06-04
Inventor： Junjie Ma , Haiwei Sun , Yuanda Lu , Shanwei Yang , Linxia Qi , Zhijun Xiong , Jiawei Zhao
IPC: H01L33/38 , H01L25/075 , H01L33/00 , H01L33/62
CPC classification number: H01L33/382 , H01L25/0753 , H01L33/005 , H01L33/62 , H01L2933/0016 , H01L2933/0066
Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.
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公开(公告)号：US20240314944A1
公开(公告)日：2024-09-19
申请号：US18027905
申请日：2022-03-29
Inventor： Shaofei GUO , Shipeng WANG , Chao TIAN , Yiping RUAN , Zhonghua LI , Jiayi LI
CPC classification number: H05K5/0021 , H05K5/0217
Abstract: A splicing display device includes: a case; display modules on the case; and a mounting structure, including a first positioning assembly on a side of the case facing the display module, and a second positioning assembly on a side of the display module facing the case, where positions of the first positioning assembly and the second positioning assembly correspond to each other in a thickness direction of the display module, and the first and second positioning assemblies contact and fit in a direction parallel to a plane in which the display module is located, so as to cause the display module to approach at least one display module adjacent thereto. The contact and fit between the first and second positioning assemblies exerts a first pressing force on the whole display module to push the display module to closely approach at least one adjacent display module thereof.
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10.发明公开公开(公告)号：US20240304762A1
公开(公告)日：2024-09-12
申请号：US18026332
申请日：2022-04-26
Inventor： Yutian CHU , Sha FENG , Zhijun XIONG , Yuanda LU , Liang SUN , Zhaohui LI , Enkai DONG , Jiacheng QI , Jinpeng LI , Qiqi ZHOU , Le WANG
CPC classification number: H01L33/46 , H01L33/62 , H01L2933/0025 , H01L2933/0066
Abstract: Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.
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