A flexible plasma surface treatment device is configured to conform to an irregular surface of an object to enable treatment of the surface with plasma formed by an electrode in the device. The flexible plasma treatment device includes a layer of flexible dielectric material having an upper surface and a lower surface, a first flexible electrode completely encapsulated within the layer of dielectric material, a second flexible electrode mounted to the lower surface of the layer of dielectric material, and a second layer of flexible electrically insulating material mounted to the lower surface of the layer of flexible dielectric material to expose a first portion of the second electrode and to cover a second portion of the second electrode at the lower surface of the dielectric material layer.