Invention Grant
- Patent Title: Seamless hexagonal boron nitride atomic monolayer thin film and method of fabricating the same
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Application No.: US15017753Application Date: 2016-02-08
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Publication No.: US09963346B2Publication Date: 2018-05-08
- Inventor: Hwansoo Suh , Youngjae Song , Qinke Wu , Sungjoo Lee , Minwoo Kim , Sangwoo Park
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Applicant Address: KR Suwon-si KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
- Current Assignee Address: KR Suwon-si KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0021777 20150212
- Main IPC: C23C16/34
- IPC: C23C16/34 ; C01B21/064 ; C23C16/02

Abstract:
A seamless hexagonal h-BN atomic monolayer thin film has a pseudo-single crystal structure including a plurality of h-BN grains that are seamlessly merged. Each of the h-BN grains has a dimension in a range from about 10 μm to about 1,000 μm. The seamless hexagonal boron nitride (h-BN) atomic monolayer thin film may be fabricated by a process including pre-annealing a metal thin film at a first temperature in a chamber while supplying hydrogen gas to the chamber; supplying nitrogen source gas and boron source gas to the chamber; and forming the seamless h-BN atomic monolayer thin film having a pseudo-single crystal atomic monolayer structure having a grain dimension in a range from about 10 μm to about 1,000 μm by annealing the pre-annealed metal thin film at a second temperature.
Public/Granted literature
- US20160237558A1 SEAMLESS HEXAGONAL BORON NITRIDE ATOMIC MONOLAYER THIN FILM AND METHOD OF FABRICATING THE SAME Public/Granted day:2016-08-18
Information query
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