- 专利标题: Heat dissipation assembly
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申请号: US15250222申请日: 2016-08-29
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公开(公告)号: US09955610B2公开(公告)日: 2018-04-24
- 发明人: Chih-Chi Wu , I-Shen Lin
- 申请人: DELTA ELECTRONICS, INC.
- 申请人地址: TW Taoyuan
- 专利权人: DELTA ELECTRONICS, INC.
- 当前专利权人: DELTA ELECTRONICS, INC.
- 当前专利权人地址: TW Taoyuan
- 代理机构: Kirton McConkie
- 代理商 Evan R. Witt
- 优先权: CN201620776101U 20160722
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H01L23/40 ; H01L23/367
摘要:
A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.
公开/授权文献
- US20180027699A1 HEAT DISSIPATION ASSEMBLY 公开/授权日:2018-01-25
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