- 专利标题: Semiconductor image sensor module and method of manufacturing the same
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申请号: US14193762申请日: 2014-02-28
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公开(公告)号: US09955097B2公开(公告)日: 2018-04-24
- 发明人: Shin Iwabuchi , Makoto Motoyoshi
- 申请人: Sony Corporation
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Michael Best & Friedrich LLP
- 优先权: JP2005-163267 20050602; JP2005-197730 20050706
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H04N5/378 ; H04N5/374 ; H04N5/225 ; H01L23/48 ; H01L27/115 ; H01L29/788 ; H01L29/792
摘要:
A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array.
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