An electrical connector for electrically connecting a chip module to a circuit board includes an insulating body with receiving holes running through the insulating body, terminals correspondingly received in the receiving holes, and metal members not in contact with the chip module. Each metal member and the terminal corresponding to the metal member are received in the same receiving hole. Each metal member has a connecting portion disposed at a side of a soldering portion of a terminal, and a clamping portion extending and bending from the connecting portion to bypass the soldering portion and extend along a direction from the side to another opposite side of the soldering portion, so that the clamping and soldering portions jointly clamp a solder ball with a reduced distance between the terminals on a strip and without the terminals being inserted into the same row of receiving holes at intervals for multiple times.