- 专利标题: Substrate liquid processing apparatus
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申请号: US14580557申请日: 2014-12-23
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公开(公告)号: US09953848B2公开(公告)日: 2018-04-24
- 发明人: Terufumi Wakiyama , Norihiro Ito , Jiro Higashijima
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Abelman, Frayne & Schwab
- 优先权: JP2013-272204 20131227; JP2014-211908 20141016
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; H01L21/687
摘要:
A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.
公开/授权文献
- US20150187613A1 SUBSTRATE LIQUID PROCESSING APPARATUS 公开/授权日:2015-07-02
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