- 专利标题： Bonding structure and method of fabricating the same
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申请号： US12774731申请日： 2010-05-06
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公开(公告)号： US09931813B2公开(公告)日： 2018-04-03
- 发明人: Kuan-Neng Chen , Wei-Chung Lo , Cheng-Ta Ko
- 申请人： Kuan-Neng Chen , Wei-Chung Lo , Cheng-Ta Ko
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- 优先权： TW99103648A 20100206
- 主分类号： B32B15/01
- IPC分类号： B32B15/01 ; B32B9/04 ; B32B7/04 ; B32B7/12 ; B32B9/00 ; B32B27/28 ; B32B3/08
摘要：
A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.
公开/授权文献
- US20110195273A1 BONDING STRUCTURE AND METHOD OF FABRICATING THE SAME 公开/授权日：2011-08-11
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