Invention Grant
- Patent Title: Pattern generator having stacked chips
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Application No.: US14086100Application Date: 2013-11-21
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Publication No.: US09865550B2Publication Date: 2018-01-09
- Inventor: Hao-Chieh Chan
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/498 ; H01L23/00 ; G06F1/32 ; H01L25/065 ; H01L25/18 ; H01L23/48

Abstract:
A pattern generator includes and upper chip and one or more lower chips. The upper chip includes an upper substrate and a plurality of conductive plates on the upper substrate. The plurality of conductive plates is arranged as an array. The one or more lower chips include one or more lower substrates and a plurality of driving circuits each on one of the one or more lower substrates and electrically coupled with a corresponding one of the plurality of conductive plates. The upper chip and the one or more lower chips are stacked one over another.
Public/Granted literature
- US20150137324A1 STARTUP CIRCUIT AND METHOD FOR AC-DC CONVERTERS Public/Granted day:2015-05-21
Information query
IPC分类: