- 专利标题： Electronic component, method for manufacturing the electronic component, and circuit board
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申请号： US14838562申请日： 2015-08-28
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公开(公告)号： US09854685B2公开(公告)日： 2017-12-26
- 发明人: Nobuo Ikemoto , Makoto Osamura , Satoshi Sasaki , Yuki Wakabayashi
- 申请人： Murata Manufacturing Co., Ltd.
- 申请人地址： JP Kyoto
- 专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人： MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址： JP Kyoto
- 代理机构： Keating & Bennett, LLP
- 优先权： JP2013-093506 20130426
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; H05K7/12 ; H05K3/30 ; H01L27/146 ; H05K1/18 ; H05K3/46 ; H04N5/225 ; H05K1/02 ; H05K1/11 ; H05K3/32 ; H01L23/00 ; H05K3/40
摘要：
A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.
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