- 专利标题： Self aligning soldering
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申请号： US13904221申请日： 2013-05-29
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公开(公告)号： US09825194B2公开(公告)日： 2017-11-21
- 发明人: Slava Hasin , Ron Helfan
- 申请人： Essence Solar Solutions Ltd.
- 申请人地址： IL Herzila Pituach
- 专利权人： Essence Solar Solutions Ltd.
- 当前专利权人： Essence Solar Solutions Ltd.
- 当前专利权人地址： IL Herzila Pituach
- 主分类号： B21D28/00
- IPC分类号： B21D28/00 ; H01L31/052 ; H01L31/18 ; H01L21/683 ; H01L31/0232 ; H01L33/58 ; B32B3/06 ; B32B7/12 ; H05K13/04 ; H01L31/02 ; H01L31/054 ; H05K1/02 ; H05K1/05
摘要：
A substrate pad for soldering at least one self-aligning component thereon, wherein at least one edge of a body of the substrate pad is shaped to conform to a corresponding edge of a component pad, and the at least one edge of the body of the substrate pad further include a plurality of pad fingers leading away from the substrate pad. Related apparatus and methods are also described.
公开/授权文献
- US20130323526A1 SELF ALIGNING SOLDERING 公开/授权日：2013-12-05
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