Invention Grant
- Patent Title: Circuit assembly for compact acoustic device
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Application No.: US15288330Application Date: 2016-10-07
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Publication No.: US09794675B2Publication Date: 2017-10-17
- Inventor: Ryan P. Rye , Christopher B. Houghton , Hae Rim Jeong , Peter Nanni , Peter M. Pavlov , Martin H. Ramsden
- Applicant: GOOGLE TECHNOLOGY HOLDINGS LLC
- Applicant Address: US CA Mountain View
- Assignee: Google Technology Holdings LLC
- Current Assignee: Google Technology Holdings LLC
- Current Assignee Address: US CA Mountain View
- Agency: Faegre Baker Daniels LLP
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H05K7/08 ; G06F1/16 ; H05K5/00 ; H05K7/14

Abstract:
A circuit assembly (600) includes a printed circuit board assembly (100). The printed circuit board assembly includes a first circuit board (101), a second circuit board (102), and a first flexible substrate (103) interposed between, and continuous with, the first circuit board and the second circuit board. A second flexible substrate (108) extends from, and is continuous with, the second circuit board. One or more electronic circuits comprising electronic components (301,302,303,304,305) are disposed along one or more of the first circuit board or the second circuit board. The printed circuit board assembly is folded about a battery (601), with the first circuit board adjacent to the first major face, the second circuit board adjacent to the second major face, and the first flexible substrate spanning the one or more side faces.
Public/Granted literature
- US20170078784A1 CIRCUIT ASSEMBLY FOR COMPACT ACOUSTIC DEVICE Public/Granted day:2017-03-16
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