Invention Grant
- Patent Title: Light-emitting device and method for manufacturing light-emitting device
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Application No.: US14476154Application Date: 2014-09-03
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Publication No.: US09773998B2Publication Date: 2017-09-26
- Inventor: Akihiro Chida , Tomoya Aoyama
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2013-184698 20130906; JP2013-218601 20131021
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L51/52 ; H01L51/00

Abstract:
A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.
Public/Granted literature
- US20150069358A1 Light-Emitting Device and Method for Manufacturing Light-Emitting Device Public/Granted day:2015-03-12
Information query
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