- 专利标题: Resistance assembly for mobile device and manufacturing method thereof
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申请号: US14696246申请日: 2015-04-24
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公开(公告)号: US09761355B2公开(公告)日: 2017-09-12
- 发明人: Jea-Hoon Lee , Woo-Jin Choi , Young-Key Kim
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: NSIP Law
- 优先权: KR10-2014-0050079 20140425
- 主分类号: H01C1/01
- IPC分类号: H01C1/01 ; H01C1/14 ; H01C7/00 ; H01C13/02 ; H01C17/00
摘要:
A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.
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