Invention Grant
- Patent Title: Micro-electro-mechanical system (MEMS) device with multi-dimensional spring structure and frame
-
Application No.: US14535022Application Date: 2014-11-06
-
Publication No.: US09733269B2Publication Date: 2017-08-15
- Inventor: Yu-Wen Hsu , Shih-Chieh Lin , Chia-Yu Wu
- Applicant: Yu-Wen Hsu , Shih-Chieh Lin , Chia-Yu Wu
- Applicant Address: TW Zhubei, Hsinchu
- Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION
- Current Assignee Address: TW Zhubei, Hsinchu
- Agency: Tung & Associates
- Main IPC: G01P15/125
- IPC: G01P15/125 ; H01L29/84 ; G01P15/08

Abstract:
The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.
Public/Granted literature
- US20160131679A1 MIRCO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE Public/Granted day:2016-05-12
Information query
IPC分类: