Invention Grant
- Patent Title: Dynamic thermal platform operating point for electronic devices
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Application No.: US14580036Application Date: 2014-12-22
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Publication No.: US09720464B2Publication Date: 2017-08-01
- Inventor: Jeremy Burr , David W. Browning , Shawn S. McEuen , Mark MacDonald , Matthew D. Coakley
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alpine Technology Law Group LLC
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K7/20 ; G06F1/20

Abstract:
In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.
Public/Granted literature
- US20160179147A1 DYNAMIC THERMAL PLATFORM OPERATING POINT FOR ELECTRONIC DEVICES Public/Granted day:2016-06-23
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